Dynamic Mechanical Analysis in the Analysis of Polymers and …
WebSep 15, 2015 · While estimates of the relative sensitivity of DMA to DSC or DTA vary, it appears that DMA is 10–100 times more sensitive to the changes occurring at the T g. The T g in highly cross-linked materials can easily be seen long after the T g has become too flat and diffuse to be seen in the DSC (Fig. 9). A highly cross-linked molding resin used ...
WebThe unreacted resin had a heat of cure of 45.7 J/g while the resin powder being evaluated had a heat of cure of 14.2 J/g. The percent cure obtained on this epoxy resin powder was calculated to be 69% based on the DSC results. This value is very useful for quality assurance and for process optimization purposes.
Optimization of a commercial epoxy curing cycle via DSC data …
WebSep 16, 2021 · Differential scanning calorimetry (DSC) is considered a traditional analysis method used to observe the curing progress and obtain the kinetic parameters of the cure reaction through fitting experimental data to appropriate mathematical models.
Comparison between cure kinetics by means of dynamic rheology and DSC ...
WebJan 3, 2024 · Comparative analysis of the chemical and rheological curing kinetics of formaldehyde-based wood adhesives is crucial for assessing their respective performance. Differential scanning calorimetry (DSC) and rheometry are the conventional techniques used for monitoring the curing processes leading to crosslinking …
WebScanning Calorimeter (DSC) and Dynamic Mechanical Analysis (DMA) to quantify it. DSC also allows one to characterize the degree of cure in a thermoset and to determine the kinetics of the cure4. DMA can characterize the rheology profile of the cure5 as well as the final modulus and Tg values after curing. In many cases, the greater sensitivity ...
An alternative method to the curing study of polymeric die attach ...
WebMar 8, 2001 · This paper introduces an alternative way to the curing investigations of polymeric die attach adhesives using dynamic mechanical analysis (DMA). Proper curing of die attach adhesives is essential to provide adhesive strength and reliability of adhesive bonding between Si die and paddle in the microelectronic industry.
Dynamic Mechanical Analysis (DMA) of epoxy carbon-fibre …
WebFeb 1, 2015 · Dynamic Mechanical Analysis (DMA) was used to characterise the curing behaviour and cure state of carbon-fibre prepreg Hexcel, type 6376 HTS. The main purpose was to investigate the effects of imperfect curing in an autoclave analogue process on mechanical properties, and how continuation of the cross-linking process can be made …
Comparison between cure kinetics by means of dynamic rheology and DSC ...
WebJan 3, 2024 · Comparison between cure kinetics by means of dynamic rheology and DSC of formaldehyde-based wood adhesives. January 2024. Journal of Cell Adhesion. DOI: 10.1080/00218464.2023.2300453....
Thermal and rheological comparison of adhesives - Springer
WebOct 10, 2019 · Glass transition temperature and residual heat of curing are related to the degree of cure. Both can be determined by DSC, which is also frequently used to study the kinetics of the curing reactions. However, DMA and rheological measurements can be more adequate for the study of the glass transition, especially for highly crystalline polymers.
WebDifferential scanning calorimetry (DSC) can investigate various characteristics of epoxy adhesives, including glass transition temperatures before and after curing, as well as the temperature and reaction calories during the curing reaction. This brief presents a measurement example using commercial two-component epoxy adhesives. Temp. (°C)
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